Techbond Group Berhad (“TECHBOND” or the “Company”) (德宝集团), a developer and manufacturer of industrial adhesives and sealants, as well as a provider of supporting products and services, was successfully listed on the Main Market of Bursa Malaysia Securities Berhad (“Bursa Securities”) and officially commenced trading under the stock short name TECHBND and stock code of 5289 at the opening of trading at 9.00 a.m. this morning.
Speaking at the listing ceremony, Managing Director of Techbond Group Berhad, Mr. Lee Seng Thye shared, “Today’s listing signals the beginning of a new phase in our corporate journey. As demonstrated from the public portion of our shares which was oversubscribed by 24.20 times, this strong interest from the members of the public will give us motivation to strive for better achievements and higher shareholders’ value in the coming years. We have developed a clear roadmap and set realistic targets which we are hopeful of achieving.”
He added, “Though Techbond’s listing today marks the end of our IPO journey, a new chapter awaits us as we bring Techbond to a higher level. Not only that, we also hope to grow from strength to strength and create value for all our shareholders as we now embark on a more challenging growth trajectory aiming for better and higher returns to all our shareholders.”
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