AI and HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight
HSINCHU, Aug. 15, 2025 /PRNewswire/ — As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore’s Law slowing and scaling challenges rising, technologies like 3DIC, Fan-Out Panel Level Packaging (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration. SEMICON Taiwan 2025 will spotlight these advances through global forums starting September 8, ahead of the main exhibition from September 10–12 at Taipei Nangang Exhibition Center.
Explosive Growth in Advanced Packaging Market
“Fueled by soaring AI demand, advanced manufacturing capacity is expected to hit a record 1.4 million wafers per month by 2028,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As AI demands surpass the limits of single-chip scaling, advanced packaging technologies like 3DIC and FOPLP are essential for system-level integration. With the industry moving from a linear supply chain to a more integrated and collaborative ecosystem, SEMICON Taiwan 2025 will serve as a vital global platform for industry leaders to explore how packaging and manufacturing innovation can unlock new commercial value across the semiconductor landscape.”
Launch of 3DIC Advanced Manufacturing Alliance
To drive global collaboration and next-gen system integration, SEMI will launch the 3DIC Advanced Manufacturing Alliance (3DICAMA) at SEMICON Taiwan 2025. The alliance aims to boost cross-industry collaboration, enhance supply chain resilience, promote standards adoption, and speed technology commercialization.
World’s Top Advanced Packaging Platform at SEMICON Taiwan 2025
SEMICON Taiwan 2025 will host the Heterogeneous Integration Global Summit (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit, covering topics from design and materials to process and supply chain. Industry leaders, including ASE, Broadcom, Lightmatter, MediaTek, Nvidia, Sony, and TSMC, will join HIGS Series to address challenges in 3DIC, CPO, and AI packaging. At the FOPLP Innovation Forum, AMD and PTI will share the latest innovations and market strategies.
This year’s Heterogeneous Integration Area will expand to three pavilions: 3DIC Advanced Packaging, FOPLP, and Semiconductor Packaging. Leading companies such as Innolux, PTI, Comet, Coherent, E&R Engineering, GP, Lam Research, Manz, Mirle, PDF Solutions, PSK, Shibaura, and Utechzone will showcase advanced integration applications and foster partnerships.
Registration for SEMICON Taiwan 2025 is now open. Apply for FREE visitor codes by August 31 and receive 20% off the International Semiconductor Forum. Visit the Official website.
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit www.semi.org or join SEMI Facebook, SEMI LinkedIn, and SEMI Official Line Account.
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SOURCE SEMI
