NEW YORK, Sept. 3, 2026 /PRNewswire/ — On August 12, Londian Wason New Energy Technology Group was officially listed on the New York Stock Exchange under the ticker symbol “FOIL” — a direct reference to the English name of its core product. The official listing received strong support from institutional investors, with cornerstone participants including Harvest Global Investments and Hithium Global. A total of 4,928,571 American Depositary Shares (ADSs) were issued at a price of US$22.00 per ADS, resulting in the total offering size of approximately US$108.43 million (including the over-allotment option).
Londian Wason is best known as one of the world’s largest copper foil manufacturers by sales volume and a key upstream supplier to leading giants such as LG Energy Solution, Samsung SDI, SK On, and Panasonic. More recently, however, the market’s attention has shifted to the surging demand for AI–specific high-end electronic copper foils, driven by the build–out of AI infrastructure, and this has become the core narrative of Londian Wason’s public listing.
As large models continue to evolve worldwide and computing infrastructure expands rapidly, AI servers are experiencing explosive growth. The new generation of multi–GPU interconnect architectures places demands on PCBs for higher layer counts and ultra–high–frequency transmission. Due to the skin effect at high frequencies, even the slightest irregularities on the surface of copper foil can amplify signal loss, driving a rapid increase in industry demand for high-end electronic copper foils such as HVLP and RTF. Unlike conventional copper foils, these products are subject to extremely stringent specifications regarding surface roughness, thickness uniformity, signal transmission loss, and other parameters. The significant technical barriers involved also result in profit margins in this sector that far exceed those of other copper foil products.
Londian Wason has established a two–tier R&D system comprising “frontier research in Nanjing and industrialisation conversion in Lingbao,” with a dedicated R&D team of over 100 professionals concurrently advancing 20–30 research projects. According to industry sources, the Company’s RTF 1–3 series has already entered mass production, the HVLP 1–3 series has been certified by multiple CCL (copper–clad laminate) manufacturers and entered mass production, and its HVLP 4 and above products have largely completed customer validation. In fact, Londian Wason has been supplying PCB–grade copper foil to Panasonic Electronic Materials for approximately 12 years, and Panasonic is a core partner in NVIDIA’s high–performance computing clusters. Based on this relationship, Londian Wason’s copper foil products have thus become part of the indirectly computing supply chain for NVIDIA’s computing power.
Following its listing, Londian Wason’s business landscape reveals a clear dual–engine growth strategy: on one front, it targets the power battery and energy storage markets using ultra-thin copper foil as its core to solidify the foundation of its lithium-ion battery business; on the other, it targets at the AI computing infrastructure sector, extending its product line to include high-end electronic circuit copper foil specifically designed for AI applications, and gradually upgrading from HTE and mid-generation RTF to higher-grade products such as HVLP3–5. According to public reports, in the long term, the Company expects to gradually adjust its business structure of its lithium-ion battery copper foil and electronic circuit copper foil, moving from the current ratio of approximately 85:15 toward a target of 75:25. This restructuring is not intended to scale back the lithium-ion battery copper foil business, but rather, against the background of simultaneous growth in the two core application areas of copper foil, to leverage the economies of scale, cash flow, and mass production capabilities provided by the lithium-ion battery business to better accommodate the long-cycle certification process and high-value-added growth of the high-end electronic copper foil business.
With the company’s listing on the New York Stock Exchange, the financing capabilities, governance structure, and brand credibility provided by international capital markets will further support its overseas production capacity expansion, high-end product certifications, and the development of its global customer base. Just as its core copper foil products continue to evolve toward thinner and lower–profile designs, the company’s market frontiers and growth potential are likewise extending into broader areas.
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SOURCE Londian Wason New Energy Technology Group
