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Midea To Unveil Industry-First Power-Cooling Hyperconvergence Architecture at Data Center World Asia 2026

Money Compass by Money Compass
September 28, 2026
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Midea To Unveil Industry-First Power-Cooling Hyperconvergence Architecture at Data Center World Asia 2026
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SINGAPORE, Sept. 28, 2026 /PRNewswire/ — Midea Building Technologies (MBT) will participate in Data Centre World Asia 2026 on September 29–30 at Marina Bay Sands, Singapore. At Booth T10, MBT will present three highlights: the industry’s first power-cooling hyperconverged architecture, a full-stack AI data centre (AIDC) cooling solution with three flagship products, and strategic collaboration with Keppel. An Omdia white paper commissioned by Midea will be released on the afternoon of September 29.

Welcome to Booth T10 and Midea's Launch Event

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As AI workloads push rack densities far beyond CPU-era designs, data centres face two critical challenges: bringing sufficient power into the facility, and removing heat efficiently once it is there. Conventional designs treat the two as separate engineering disciplines — an approach that becomes harder to sustain as rack power climbs.

To address them, MBT will launch the AIDC Converged Infrastructure White Paper, developed with CLOU Electronics. This white paper puts forward a future trend with hyperconverged architecture as the core. This architecture integrates electrical power, energy storage, magnetic-bearing cooling sources and liquid-cooling CDU systems into a unified stack. By coordinating power, storage and cooling at the system level, it provides a technical pathway for high-density, high-efficiency and low-carbon AI data centre development.

Another key highlight will be MBT’s full-stack AIDC cooling solution, connecting cooling source, distribution and terminal heat rejection for high-density, high-temperature and water-constrained computing environments. The Magnetic CDU serves as a core product: by integrating a magnetic-bearing cooling source with coolant distribution in one system, it is designed to reduce equipment footprint by up to 70%, shorten deployment time and support system PUE below 1.2 under suitable operating conditions. The Air-Cooled Magnetic Bearing Centrifugal Chiller, with a COP of up to 5.4, and the Industrial-Grade CDU, offering 2.6 MW of cooling capacity, will complete the lineup.

In addition, MBT is strategically cooperating with Keppel to present the iconic Gui’an Midea Cloud Data Centre project. Combining MBT’s HVAC capabilities with Keppel’s digital infrastructure expertise, the project delivers up to 7,654 hours of free cooling annually at a stable PUE below 1.2 — a practical example of energy-efficient design and operation at scale.

MBT invites customers, partners and industry professionals to Booth T10 to explore its system-level thermal management innovations for the high-density AI era.

Cision View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/midea-to-unveil-industry-first-power-cooling-hyperconvergence-architecture-at-data-center-world-asia-2026-302891240.html

SOURCE Midea Building Technologies (MBT)

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