Accelerating High-Performance Computing and Thermal Innovation for the Future
KAOHSIUNG, Oct. 14, 2025 /PRNewswire/ — SUNON, a global leader in thermal solutions, is showcasing its next-generation liquid cooling systems at OCP Global Summit 2025, taking place from October 13–16. These solutions are engineered specifically for server and AI computing applications, providing modular, energy-efficient, and highly reliable thermal management for open compute infrastructure.
SUNON to Showcase Liquid Cooling Solutions at OCP Global Summit 2025 Collaborating with the Industry to Shape the Future of Open Compute
Under the theme “Build to Chill,” SUNON highlights its long-standing dedication to thermal R&D. “Build” represents our mission to engineer market-leading, high-efficiency cooling systems, while “Chill” goes beyond cooling—it’s about delivering stable, quiet, and dependable performance to empower our customers with total confidence in every deployment.
Three Core Innovations Unveiled in 2025
Open Loop Cold Plate Series:
Cold Plates Designed for Intel/AMD server CPUs, SUNON’s open-standard cold plates enable high performance and seamless integration across multiple server platforms. Beyond standard off-the-shelf models, SUNON also provides customized specifications and feature extensions, ensuring compatibility with diverse industry challenges and demanding computing requirements.
Coolant Distribution Unit (CDU):
Launch of the Liquid-to-Liquid CDU, featuring a modular design that allows flexible configuration options while ensuring ease of maintenance.
Closed-Loop Liquid Cooling Systems:
The closed-loop liquid cooling systems offers multiple component options to support various application scenarios, meeting diverse and highly customized product requirements.
With over 45 years of expertise in thermal innovation, SUNON offers the advantages of Liquid Cooling Systems:
Standard Product Lines: Covering both air and liquid cooling, SUNON provides easy-to-integrate thermal components that reduce entry barriers for customers while enabling transition to higher wattage liquid-cooled systems.
Total Thermal Solution: Combining advanced air and liquid cooling technologies, SUNON delivers fully optimized solutions that balance performance, quality, and cost-efficiency, enabling customers to meet future computing demands with speed and confidence.
Powering the Next Era of Computing with Liquid Cooling
SUNON’s new liquid cooling designs are built for computational scalability, offering customers complete system architecture insight and implementation strategies for next-gen deployments. By continuing to innovate in sustainable thermal design, SUNON is committed to advancing open infrastructure and building a future where high performance meets environmental responsibility.
We warmly invite partners, decision-makers, and media to visit Booth A53 and explore how next-gen liquid cooling is shaping the future of data center innovation.
Visit Us at OCP Global Summit 2025
Exhibition Details
Event: 2025 OCP Global Summit
Date: October 13–16, 2025
Venue: San Jose McEnery Convention Center | San Jose, California, USA.
SUNON Booth No : A53
