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INVT at DCW Asia 2026: Power and Cooling for Higher-Density Data Centers

Money Compass by Money Compass
October 2, 2026
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INVT at DCW Asia 2026: Power and Cooling for Higher-Density Data Centers
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SINGAPORE, Oct. 2, 2026 /PRNewswire/ — INVT showcased integrated power and liquid cooling solutions at Data Centre World Asia 2026, held September 29–30 in Singapore. The display highlighted how coordinated power distribution, thermal management and infrastructure planning can help data centers accommodate growing AI workloads.

For operators across Asia, the challenge is preparing existing facilities and new projects for greater computing demand while balancing deployment efficiency, reliability and return on investment.

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INVT at Data Centre World Asia 2026

Coordinating Power and Cooling

INVT presented its full modular data centerportfolio, including single-row, dual-row and containerized solutions, alongside the iTalent Liquid-Cooled Modular Data Center. The iTalent system integrates liquid-cooled cabinets, power distribution, intelligent monitoring and secondary-loop piping within a pre-engineered module to simplify on-site integration.

For new facilities and phased expansions, these solutions support coordinated planning that considers deployment requirements, initial investment and long-term operating costs.

The iTalent system incorporates INVT’s coolant distribution unit (CDU) technology, featuring redundant pumps, leak detection, and real-time temperature and pressure monitoring. Standalone CDU options support gradual liquid cooling adoption, enabling upgrades around existing heat-rejection capacity, piping conditions and IT requirements.

Megawatt-Class Power Per Cabinet

INVT also presented its RM modular UPS, with capacities from 100 to 1200 kVA, and a 150 kW power module in a compact 3U form factor, with double-conversion efficiency of up to 98.3%.

The compact design helps optimize space utilization, while modular architecture supports capacity additions as IT demand grows, helping operators align investment with deployment stages and reduce initial over-provisioning.

The exhibition connected these product capabilities with practical project decisions: how to introduce liquid cooling, allocate space for power equipment and expand infrastructure as demand develops. This approach supports discussions between operators, consultants and engineering teams before equipment selection and site integration.

Connecting Manufacturing with Project Delivery

“Operators upgrading existing facilities or building new capacity need to consider equipment compatibility, delivery schedules and long-term support,” said Real, INVT’s ASEAN Director. “Our in-house engineering and manufacturing capabilities give project teams direct access to discussions on configurations, interfaces and factory testing, helping address integration requirements early.”

About INVT

Founded in 2002, Shenzhen INVT Electric Co., Ltd. is listed on the Shenzhen Stock Exchange (stock code: 002334). Its data center infrastructure portfolio includes UPS, precision cooling and integrated modular solutions for telecommunications, finance, education and other sectors. INVT’s data center equipment serves customers in more than 120 overseas countries and regions.

Contact:[email protected]

Cision View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/invt-at-dcw-asia-2026-power-and-cooling-for-higher-density-data-centers-302896804.html

SOURCE Shenzhen INVT Electric Co., Ltd.

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